For each special via, provide start and stop layers, finished or laser diameter, capture and target pads, stacked or staggered relationship, fill and cap requirement, and any controlled-depth or reliability condition. The via map must agree with the stack-up and drill data.
Via-table fields
A clear table allows engineering to derive the lamination and drilling route without inferring layer transitions from imagery alone.
- Via identifier and start/stop layers
- Mechanical or laser process intent
- Hole or via diameter plus capture and target pads
- Stacked, staggered, skip, or through relationship
- Conductive or non-conductive fill, cap, and planarization requirement
- Finished condition and inspection requirement
Capability values are planning boundaries
HXLFAB publishes 0.10 mm as a minimum laser-via capability, subject to construction review. Practical geometry depends on material, pad relationships, aspect, lamination sequence, registration, and reliability requirements.
Next useful step
Final capability, commercial terms, and project records are confirmed against the actual RFQ and written project documents.