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PCB manufacturing · Guilin production base · Shenzhen service officesales@hxlfab.com

Stack-up & materials

What stack-up information is needed?

Provide layer order, copper by layer, dielectric or material intent, finished thickness, impedance structures, and any construction that must not change.

Reviewed
Direct answer

Provide the layer order and function, copper weight for each layer, target finished thickness, laminate or performance requirements, dielectric constraints, impedance structures, and any blind, buried, microvia, or mixed-material construction. Mark which values are mandatory and which may be optimized during engineering review.

Useful stack-up fields

A proposed construction is more useful than layer count alone. It lets material, geometry, drilling, lamination, thickness, and impedance be reviewed together.

  • Layer number, signal/plane function, and reference relationships
  • Base and finished copper requirement per layer
  • Core and prepreg material or performance class
  • Target dielectric thickness where electrically or mechanically controlled
  • Overall finished thickness and tolerance
  • Impedance target linked to the applicable layers

Allowing an engineering proposal

If HXLFAB may propose a manufacturable construction, state the electrical, mechanical, material, reliability, and total-thickness constraints that must be preserved. No material substitution or geometry change should be assumed approved without agreement.

Next useful step

Final capability, commercial terms, and project records are confirmed against the actual RFQ and written project documents.

Need this applied to your board?

Send the actual data for an engineer-confirmed answer.

Ask engineering ↗Start an RFQ →