What stack-up information is needed?
Provide layer order, copper by layer, dielectric or material intent, finished thickness, impedance structures, and any construction that must not change.
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Stack-up & materials
Define the construction, laminate, impedance, RF, and HDI inputs behind the board.
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What data is needed for controlled impedance?
An impedance value alone is incomplete; connect each target to its structure, layers, geometry, tolerance, material assumptions, and verification plan.
Read answerHow should RF material be specified?
Name the exact laminate or performance requirement and state whether alternatives are allowed; RF substitutions should never be assumed.
Read answerWhat should an HDI via table include?
Map every special via type to its start and stop layers, dimensions, treatment, and stacking relationship.
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