Layer count
Prototype and volume multilayer fabrication
High-mix PCB fabrication · Engineering-led review
HXLFAB manufactures multilayer, HDI, high-frequency and heavy-copper PCBs for communications, industrial, medical, automotive and emerging hardware programs.

Manufacturing envelope
Our engineering team reviews stack-up, material, impedance, via structure and test requirements before confirming manufacturability, lead time and commercial terms.
Prototype and volume multilayer fabrication
75 μm / 75 μm manufacturing capability
0.15 mm minimum mechanical drill
Finished thickness from 0.15–7.0 mm
Heavy-copper programs subject to review
TG135 / 150 / 170, CAF and halogen-free
Capability values are based on the supplied company profile and remain subject to engineering review by design, material and volume.
Real factory. Real process control.
On-site imagery from the Guilin manufacturing base—showing CAM preparation, automated processing, plating and precision drilling.




Quality assurance
Incoming material control, AOI, electrical testing, impedance measurement, metallographic analysis and final inspection are integrated into the workflow.
Certifications listed in the supplied company profile. Current certificate copies and scope documents are available for qualified projects upon request.
Inspection resources
Products & markets
Rigid multilayer, HDI, impedance-controlled, high-frequency, heavy-copper, ultra-thin and mixed-material PCB programs.
Secure PCB RFQ
Build a fabrication brief and upload production files directly to HXLFAB private storage. Every submission receives a traceable RFQ number.