Layer count
Prototype and volume multilayer fabrication
High-mix PCB fabrication · Engineering-reviewed quotation
Complex PCB manufacturing.
Assumptions made clear.
Share your manufacturing data and requirements. HXLFAB reviews stack-up, materials, vias, impedance, testing and commercial inputs before confirming a quotation.
CAM + DFMData completeness & risk review
Stack-upMaterial, vias & impedance
Test planElectrical & targeted verification
Traceable RFQPrivate production-file route
Manufacturing envelope
Built for complex boards,
from NPI to volume.
Our engineering team reviews stack-up, material, impedance, via structure and test requirements before confirming manufacturability, lead time and commercial terms.
Minimum trace / space
75 μm / 75 μm manufacturing capability
Minimum laser via
0.15 mm minimum mechanical drill
Maximum panel
Finished thickness from 0.15–7.0 mm
Inner / outer copper
Heavy-copper programs subject to review
Material systems
TG135 / 150 / 170, CAF and halogen-free
Capability values are based on the supplied company profile and remain subject to engineering review by design, material and volume.
PCB manufacturing services
Choose the right
technology path.
Each capability page explains the engineering inputs, manufacturing limits and files needed for an accurate PCB quotation.
01Multilayer PCB
4–30 layer rigid boards for dense digital, industrial and communications designs.
Explore capability → 02HDI & microvia PCB0.10 mm laser-via, blind, buried and via-in-pad constructions by review.
Explore capability → 03High-frequency PCBPTFE, Rogers, Isola and mixed-material stack-ups for RF applications.
Explore capability → 04Heavy copper PCBUp to 4 oz inner and 8 oz outer copper for power and new-energy hardware.
Explore capability → 05Impedance controlled PCBStack-up review, defined coupons and impedance measurement.
Explore capability → 06PCB prototypes & NPIEngineer-reviewed prototype builds designed with production transfer in mind.
Explore capability →Company-supplied factory evidence
Production you can inspect.
See the supplied factory imagery, the manufacturing route and the distinction between real evidence and representative product visuals. Open Factory & Process →
Quality assurance
Evidence before badges.
Incoming material control, AOI, electrical testing, impedance measurement, metallographic analysis and final inspection are integrated into the workflow.
Document statusProject recordsTest planning
Certification claims are separated from the current documents, scope and validity that must be checked during supplier qualification. Review quality evidence →
Inspection resources
- 01Automatic optical inspection
- 02Flying probe & four-wire testing
- 03Impedance & line-width measurement
- 04Microsection microscopy & TG testing
- 05Environmental and chemical laboratory
Evaluate the manufacturing partner
Evidence behind
the capability claims.
Move from a technical capability page to the documents, process, engineering questions and commercial assumptions needed for a supplier decision.
Secure PCB RFQ
Define the board.
Upload with confidence.
Build a fabrication brief and upload production files directly to HXLFAB private storage. Every submission receives a traceable RFQ number. Not ready to upload? Ask sales engineering first →