Provide copper weight for every layer, minimum conductor width and clearance, current and thermal intent, copper distribution, stack-up, material, finished thickness, hole and plating requirements, surface finish, quantity, and acceptance criteria. HXLFAB lists capability up to 4 oz on inner layers and 8 oz on outer layers, subject to design review.
Review the construction as a system
Heavy copper changes etch compensation, spacing, resin fill, copper balance, hole-wall requirements, and overall thickness. Standard one-ounce rules should not be assumed.
- Copper weight and geometry by layer
- Current, temperature-rise, or thermal-spreading intent
- Dielectric, resin-fill, and symmetry constraints
- Finished-hole and plating requirement
- Surface finish, electrical test, and microsection criteria where required
Separate capability from electrical validation
Manufacturing review can identify process constraints, but conductor sizing and thermal performance remain product-design decisions. Provide the approved fabrication geometry rather than asking the fabricator to infer the electrical requirement.
Next useful step
Final capability, commercial terms, and project records are confirmed against the actual RFQ and written project documents.