Engineering approach
Copper weight changes the complete design rule set
Heavy copper supports current carrying, thermal spreading and mechanical robustness, but it also changes etching behavior, conductor spacing, hole-wall plating, dielectric fill and overall thickness. Standard one-ounce design rules should not be copied directly into a thick-copper build.
HXLFAB reviews copper distribution, minimum features, clearances, thermal transitions, via requirements and stack-up symmetry before confirming a heavy-copper production route.
Engineering inputs that matter
- Copper weight by layer, not only a single overall value
- Minimum conductor width, clearance and current requirement
- Thermal distribution and copper-balance strategy
- Finished thickness, hole sizes and plated-hole requirements
- Surface finish, solder-mask clearance and assembly constraints